DragonFly 3D Printer
The world's first professional 3D Printer for Electronics
Introducing the Dragonfly 3D Printer
The DragonFly LDM Lights-Out Digital Manufacturing system is the industry’s only comprehensive additive manufacturing platform for 24-hour 3D printing of electronic circuitry. This precision additive manufacturing platform uniquely integrates an extremely precise inkjet deposition printer with dedicated nano-inks and optimized 3D software to print electronic circuits such as Printed Circuit Boards (PCBs), antennas, capacitors, and sensors.
The DragonFly 3D Printer incorporates the proprietary, state-of-the-art Lights-out Digital Manufacturing (LDM) technology, requiring little or no operator intervention.

White Paper
Harris Corp. 3D prints RF amplifiers using Nano Dimension’s Dragonfly Pro. Performance is comparable to traditionally manufactured circuits. Tests Demonstrated Viability of 3D Printed Electronics for Rapid, Affordable Prototyping and Low-Volume Manufacturing of Antennas.
Why choose the Dragonfly 3D Printer fof 3D PCB Printing?
Fast and safe New Product Development
With the DragonFly 3D Printer designers can move rapidly from concept and design validation to production of precision electronic components, while keeping the entire process securely in-house.
Lower the total cost of operation
Companies can now reduce demand for prototyping and short-run manufacturing resources and lower the total cost of operation in comparison to traditional manufacturing methods.
Designed for Industry 4.0
The DragonFly PCB Printer is designed for Industry 4.0 and manufacturing for the Internet of Things and is the extension of the award-winning DragonFly Pro precision system.
Freedom to Innovate
With the Dragonfly LDM you can innovate freely without traditional manufacturing process constraints. You can be a pioneer while saving space, weight, and cost with designs incorporating complex geometries and new functions.
Key Advantages and Benefits of a Professional PCB Printer
The Dragonfly PCB Printer is not only the latest technology for manufacturing, but it is also a choice that, compared with usual methods has a lot of advantages, from many points of view:

White Paper
Utilizing a newly developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT succeeded in assembling the world-wide first 10-layer printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Previously, 3D printed boards could not bear the soldering process necessary for two-sided population of components.
Multi-Material Additive Manufacturing of Printed Electronics
Simultaneous multi-material additive manufacturing is a revolutionary approach that helps redefine the electronics of tomorrow for attributes including density, size, and flexibility. The DragonFly LDM simultaneous multi-material additive manufacturing is a revolutionary approach developed by Nano Dimension that helps redefine the electronics of tomorrow for attributes including density, size, and flexibility.
The DragonFly PCB Printer is fitted with two printheads, one for nano-Silver conductive ink and the other for dielectric polymer ink. This set-up allows the DragonFly LDM to concurrently print with both advanced inks in a single print job.

Virtually Limitless Design Flexibility
More efficient collaboration within the company
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Discover all the features of the 3D Printer for Electronics and its technical specfications.
Explore Capabilities and PCB Printer Use Cases
The 3D printed electronic device showed here is a 5V to 18V Up Converter powering 4 LEDs. The Up-Conversion is achieved with a set of two concentric 20 turns coils manufactured during the additive manufacturing process. A total of 13 mounted components are soldered either manually or by solder reflow procedures specified by Nano Dimension.
Stacked ICs in an AME (Additively Manufactured Electronic) structure have a higher circuitry density than traditional PCBs by allowing ICs to be mounted and interconnected on top of each other. The circuit uses a combination of High-Density Interconnects (HDI) and vias to enable vertically assembled integrated circuits. Thus mounting of ICs with varying sizes from small to large and reducing the total AME surface area. Up to 4 ICs that conform to the specific pin layouts can be stacked.
Side mounting of components in AMEs (Additively Manufactured Electronic) enables the use of an area not common for mounting components, resulting in a smaller AME as compared to all components being on the top or on top and bottom of the AME. Furthermore, side-mounted components also enable the creation of customized small AMEs that can be inserted into a socket to provide configuration-specific functionality to a generic PCB motherboard.
Side mounting of components in Additively Manufactured Electronic enables the use of an area not common for mounting components, resulting in a smaller device as compared to all components being on the top or on top and bottom of the circuit. In addition, the availability of a battery socket produced during the additive manufacturing process, eliminates the need to purchase this component and the related assembly process, therefore improving reliability and reducing overhead cost.
To maintain good data integrity, accurate send and receive data signals are required. The 3D printed IoT/WiFi access point circuit demonstrates a fully functional device with a tested data transmission and reception accuracy of over 99%. The high accuracy of the 2.4GHZ data transmission is due to the dielectric properties and the antenna’s tight dimension control enabled by the additive manufacturing technology of the DragonFly LDM system.
Find out more about the Dragonfly 3D Printer
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