PCB Simulation
Maximize the benefits of PCB virtual prototyping to develop higher quality products, faster
The Xpedition Enterprise design flow includes a complete suite of high-speed PCB simulation tools, powered by HyperLynx. They enhance crucial virtual prototyping capabilities, such as Analog/mixed-signal simulation; Electrical rule checking for SI, PI, EMI issues; Power integrity analysis; Signal integrity analysis; Thermal analysis.
These PCB Simulation tools provided by Siemens made possible by HyperLynx can increase design performance, minimize re-spins and get your products to market faster.
Signal Integrity (SI) Analysis
Signal Integrity (SI) Analysis
HyperLynx Signal Integrity generates fast, easy, and accurate signal integrity analysis in PCB systems design.
Engineers can efficiently manage rule exploration, definition, and validation, ensuring that engineering intent is fully achieved.
The software is tightly integrated into the design flow, from schematic design through final layout verification.
Power Integrity (PI) Analysis
Power Integrity (PI) Analysis
HyperLynx PI identifies potential power integrity distribution issues that can interfere with board design logic, and investigate and validate solutions in an easy-to-use, “what-if” environment.
This intuitive tool gives any member of your design team the ability to quickly and accurately analyze power integrity, without the usual steep learning curve of most power analysis products.
Design team access to these sophisticated power integrity capabilities will help companies reduce prototype spins, shorten time to market, and allow engineers to develop more reliable products.
Full-wave/Hybrid EM Analysis
Full-wave/Hybrid EM Analysis
HyperLynx Full-Wave Solver delivers unprecedented speed and capacity, through accelerated boundary element technology, while preserving gold-standard Maxwell accuracy. Achieve greater accuracy and fewer re-spins, even on the most complex structures.
Designers can take advantage of high speed, accuracy and capacity for signal integrity, power integrity and EMI concerns – all from within a common interface. The EM solver is built from the ground up to exploit multi-core and hybrid architectures, and to utilize the best of fast solver technology to enable fast simulation on a single core or multiple cores.
Power-aware SI trace model extraction can be performed, as well as DC and AC power integrity analysis at the system (package/PCB) level. Designers can benefit from a power delivery network impedance profile, capacitor loop inductance, and combined signal and power broadband S-parameter extraction for use in time-domain simulation – all within a common, easy-to-use interface.
Thermal Analysis
Thermal Analysis
HyperLynx Thermal analyzes board-level thermal conditions on placed, partially routed, or fully routed PCBs. It simulates conduction, convection and radiation, and produces temperature profiles, gradients, and excess temperature maps, resolving board and component overheating early in the design process.
By adjusting the design using what-if scenarios, engineers and PCB designers can reduce mean time between failures by as much as 50 percent, improving product quality and ultimately decreasing warranty costs.
Vibration and Acceleration Analysis
Vibration and Acceleration Analysis
Due to design flaws, newly launched electronic products currently experience a field failure rate of 15-20% in the first year, resulting in warranty claims and high levels of field returns. Xpedition Design for Reliability (DfR) enables early detection of PCB design vulnerabilities due to physical use, reducing costs and shortening cycle time.
Xpedition DfR provides two options for quick PCB design simulation: Vibration analysis and Constant Acceleration.
Analog/Mixed-Signal Circuit Simulation
Analog/Mixed-Signal Circuit Simulation
Xpedition AMS expands standard SPICE-based circuit analysis to leverage industry advances in PCB modeling and simulation, accelerate circuit development, and speed verification.
Quasistatic Extraction
Quasistatic Extraction
HyperLynx Fast 3D Solver enables efficient, full package model creation with multi-processing for faster turnaround time. It is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model generation while accounting for skin effect impact on resistance and inductance.
Fast solver technologies enable rapid simulation on single and multiple cores. It is 20x-100x faster than other equivalent solutions and maintains full-3D gold-standard EMQS accuracy. The intuitive GUI enables users working with the latest system-in-package (SiP), package-on-package (PoP), stacked die, and multi-chip module (MCM) scenarios to easily extract accurate models with minimum extraneous effort on boundary conditions and port definitions.
Whether the specific application is related to a high-performance microprocessor design, a low-cost ASIC and system design, power integrity, signal integrity, or simultaneous switching noise, effective solutions are available for all design types.
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