Electronics Cooling with PADS Flotherm XT
Perform Thermal Simulation in all the stages of the Design flow
Electronics Cooling for the Entire Design Space with Flotherm XT
Insufficient cooling can result in schedule delays, low reliability, and increased product costs, especially in today’s high-performance devices where components are densely packed into ever-smaller enclosures.
PADS Flotherm XT enables Thermal Management of the entire design space so that you can supply timely, cost-effective, and reliable electronic products.
You can create the Digital Twin of your product just as you are designing it, and follow it until the end of the process, thanks to the integrated flow provided by Siemens.
PADS Flotherm XT is a CAD-based solution for Electronics Cooling
PADS Flotherm XT is a high-level solution for Electronics Cooling, which can be adopted right from the component placement phase, to identify thermal effects in the entire system. Using the SmartParts™ feature, designers can create simple models in minutes, applying complex mechanical parts directly from mechanical CAD, easily creating custom CAD geometries, and importing complex electronic assemblies from EDA tools. PADS Flotherm XT considers all thermal aspects of the project, including box, PCB layout, board structure, space definition. It has a direct interface with all the main mechanical CAD products and with all interchange formats.
You can easily create a Digital Twin of your product to test it in any condition of real use. Export your PCB from PADS and perform a thermal simulation using the powerful and accurate meshing methods of Flotherm XT.
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