Simcenter Flotherm XT
Electronics Thermal Analysis for Time and Cost Optimization
Simcenter Flotherm XT is a CAD centric electronics cooling simulation software, which allows you to reduce time to market, get the product right the first time, and eliminate design iterations connecting and integrating MCAD and ECAD workflows.
You can successfully meet the challenge of increasing product miniaturization by quickly optimizing the design of components such as heat sinks, fans, TECs or liquid cooling through the use of parametric studies.
Why choose Simcenter Flotherm XT for Electronics Thermal Analysis?
The most complete and accurate solution in the market
Simcenter Flotherm XT is the most complete and accurate solution in the market, with a reputation of more than 30 years of development. Siemens‘ software is dedicated to specialists in Electronics Thermal Analysis.
Thermal simulation has never been easier
Although Flotherm XT is a tool that allows you to simulate electronic devices of any kind of complexity, it is really simple to use. Its integration into a 3D CAD workspace allows designers to import their mechanical design. Also, SmartPart™ technology allows users to quickly build electronic components such as heatsinks, cases, fans.
A Dedicated Electronics Technology
Flotherm XT is a solution specifically dedicated to Electronics Thermal Analysis and Electronics Cooling Simulation. Technologies like PCB Import from ODB++, FLOEDA Bridge, and Joule Effect simulation make designers confident about the thermal performance of their devices.
Effective coverage of the entire supply chain.
Flotherm XT has already implemented libraries of electronic components (IC packages, fans, heatsinks, TEC etc.) available for designers. Full support of PDML files allows you to import easily and effectively use thermal models from the entire supply chain.
Simcenter Flotherm XT supports the entire Electronics Supply Chain
Electronics products are designed in stages. Different companies design and manufacture different parts and sub-assemblies; each making assumptions about how these are cooled, and designing them in anticipation of that. For example, a CPU for a computer may be designed so that heat can be easily removed through a heatsink attached to the top of the package. So thermal design is performed from the integrated circuit, chip, or die-level, all the way up to data centers. Suppliers provide thermal models to assist their customers with their thermal design at the next packaging level. While the thermal design is important at each level, it should be optimized for cost, weight, volume, etc. for the final product.
Optimization at the final product level is possible by creating a 3D CFD model of the entire system in Simcenter Flotherm XT at the ideation stage of the process. Furthermore, Simcenter Flotherm has the SmartPart™ technology and a library infrastructure to support the supply chain.
8 Key Flotherm XT Strengths in Electronics Thermal Analysis
Accelerate New Product Introduction (NPI)
CAD-based SmartParts speed model building
In-built Parametric Study Capability
Sophisticated Detailed IC Package Models
Detailed Model Calibration using T3Ster data
EDA Bridge & Direct PCB Copper Representation
Full Geometric Flexibility using Embedded Solid Modeller
Imports Flotherm Projects & Assemblies
Try Out our Solutions for Electronics Cooling:
Find out more about lorem ipsium
Learn how to improve enclosure design in this guide covering 14 considerations on thermal management best practice. Examples of areas to focus on for advantages in cooling efficiency are illustrated and where tradeoff decisions are needed.
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